New IC Technologies Required to Match Next Generation E-Credentials
Written on 1:03 AM by AKS
These huge number of applications demand one common thing that is a powerful contactless smart IC. A smart IC with improved memory capabilities and faster computing speed is better equipped to handle the data storage, processing and security demands of these second generation implementations.
In future the following IC's technologies need to be integrated with the biometric or other electronic security to match.
FRAM (Ferroelectric Random Access Memory): FRAM, the next-generation of embedded IC memory, writes data almost 1,000 times faster than the more commonly used EEPROM and accesses data 3 times faster. It requires only 1.5 volts to write. FRAM has 100 trillion write and read cycles and provides a 10-year data retention at 185 degrees Fahrenheit.
130 Nanometer Production: Double the amount of circuitry can be fixed on the chip in a given unit area using the 130 nm process node as compared to the 180 nm process node typically used to make smart ICs currently. It can be used to place more memory within smaller ICs using less power than can be achieved using traditional embedded memory technology approaches.
Unified Cryptographic Engine: It includes symmetric cryptography, necessary encryption and decryption capabilities and public key functionality that enables advanced authentication. An unified cryptographic engine delivers faster performance through separate, dual-core data encryption standard co-processors, which enables symmetric calculations to happen simultaneously.
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